Creating compact near-sensor computing chips via 3D integration of 2D materials

Three-dimensional (3D) integration has opened new possibilities for the development of denser circuits with more interconnected electronic components. 3D integration approaches entail stacking multiple layers of electronic circuits together, ultimately producing more compact and efficient devices.

This post was originally published on this site

Skip The Dishes Referral Code

Lawyers Lookup - LawyersLookup.ca