Research published in the International Journal of Information and Communication Technology may soon help solve a long-standing challenge in semiconductor manufacture: the accurate detection of surface defects on silicon wafers. Crystalline silicon is the critical material used in the production of integrated circuits and in order to provide the computing power for everyday electronics and advanced automotive systems needs to be as pristine as possible prior to printing of the microscopic features of the circuit on the silicon surface.
Solving long-standing challenge in semiconductor manufacturing—a refined algorithm for detecting wafer defects
