Method for creating 3D integrated circuit connections at low temperatures that does not require external pressures

Scientists from the Flexible 3D-System Integration Laboratory at Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver, which can reduce the cost and energy requirements of new electronic devices. This work may help in the design of next-generation smart devices that are more compact and use less electricity.

This post was originally published on this site

Skip The Dishes Referral Code

Lawyers Lookup - LawyersLookup.ca